Digital Electronics

When nuances of advancements matter, SFO is the perfect partner. With our extensive knowledge of advanced digital hardware design, complex software algorithms and our expertise in manufacturing all types of PCBAs for mission-critical applications, SFO is perfectly placed to provide a suite of best in class services for our customers.

SFO’s electronics facilities are equipped with the latest and the most sophisticated manufacturing and test equipment, including the capability build rigid, flex and ceramic substrates assembly and thick film hybrid microcircuit assembly, also providing die-bonding and wire bonding. SFO has a dedicated facility for RF, wireless & microwave components, sub-systems, and HLA which is equipped with extensive test and measurement devices such as Spectrum/Network Analyzers, RF signal generators, sweep oscillators etc, equipped to do RF testing up to 10GHz which is manned by skilled technicians who have been given specific training in this area. The facility has the capability to

Key Expertise:
  • Multiple Surface Mount, Through Hole and Chip on board lines
  • High level assembly, mechanical integration and total box build
  • Low level and High level, IPC class PCB Assemblies, conforming to ROHS and REACH standards
  • ROHS and Non ROHS line
  • IPC Class 3 Soldering
  • Robotic conformal coating
  • No clean, water wash and vapour degreasing capability for Ultra-clean PCBAs
  • AOI, ICT, FCT and X-ray Inspection (with in-line 3D X Ray)
  • Flying probe testing
  • Environmental Cycling Chambers
  • Reliability Testing
  • NADCAP Certified Plants ( Kochi & Gardena )
  • ITAR compliant Plant with the US Department of State ( Qual Pro Corporation, Gardena, USA )